Intel 10M50DCF256I7G: A Comprehensive Technical Overview of the MAX 10 FPGA

The Intel (formerly Altera) MAX 10 FPGA represents a significant evolution in non-volatile, low-cost programmable logic. The 10M50DCF256I7G is a specific device within this family that encapsulates a powerful set of features in a compact package, targeting a wide array of applications from industrial control systems to communication infrastructure. This article provides a detailed technical examination of this component.

As a member of the MAX 10 family, this device is built on a 55-nm embedded flash process technology. This foundational choice is critical, as it integrates both the FPGA fabric and configuration flash into a single die. This single-chip solution eliminates the need for an external configuration device, which reduces board space, component count, overall system cost, and enhances security and reliability.

The device nomenclature, 10M50DCF256I7G, offers a clear breakdown of its key attributes:

10: Denotes the MAX 10 family.

M50: Indicates a logic density of approximately 50,000 logic elements (LEs). This provides ample resources for complex state machines, data processing, and control logic.

D: Signifies that the device features an integrated Analog-to-Digital Converter (ADC).

C: Indicates that the device is a commercial-grade part.

F256: Specifies the package type as a FineLine BGA with 256 pins.

I7: Represents the speed grade.

G: Denotes that it is a RoHS-compliant, halogen-free device.

Beyond its core logic fabric, the 10M50DCF256I7G is rich in embedded memory resources. It contains over 1.6 Mbits of embedded RAM, configurable as true dual-port RAM, FIFO buffers, or ROM. This is complemented by up to 144 Kbits of user flash memory (UFM), which is ideal for storing non-volatile data such as system parameters, serial numbers, or fail-safe boot images.

A standout feature of this FPGA is its on-chip dual-configuration flash and integrated Analog-to-Digital Converter (ADC). The dual-configuration flash allows for instant-on functionality and supports remote field updates with fail-safe recovery mechanisms, a vital feature for systems that cannot afford extended downtime. The integrated ADC, with up to 18 channels, can sample external analog signals directly, reducing the need for external ADC chips and simplifying analog sensor interfacing.

The device supports a wide range of I/O standards, including LVCMOS, LVTTL, LVDS, and SSTL, offering significant flexibility for interfacing with other components like processors, memory, and peripherals. Its low-power characteristics, driven by the advanced process technology and programmable power management, make it suitable for power-sensitive applications.

In application, the Intel 10M50DCF256I7G FPGA is exceptionally versatile. It is commonly deployed as a "universal glue logic" component, consolidating functions such as I/O expansion, level translation, bus bridging, and power-up sequencing. It is also widely used for motor control in industrial automation, signal processing in communication cards, and system management in embedded computing.

ICGOOODFIND: The Intel 10M50DCF256I7G FPGA is a highly integrated, cost-optimized solution that successfully merges the flexibility of programmable logic with the convenience of non-volatile configuration and analog capabilities. Its single-chip architecture, moderate logic density, and rich feature set make it an excellent choice for designers looking to reduce system complexity, enhance reliability, and accelerate time-to-market for a diverse set of embedded applications.

Keywords: MAX 10 FPGA, Non-Volatile Configuration, Integrated ADC, 50K Logic Elements, Single-Chip Solution